Hpf190-03n Vacuum Oven, Mainly Used for The Drying, Degumming and Curing of Electronic Components in a Vacuum or Atmosphere Environment

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  • Hpf190-03n Vacuum Oven, Mainly Used for The Drying, Degumming and Curing of Electronic Components in a Vacuum or Atmosphere Environment
  • Hpf190-03n Vacuum Oven, Mainly Used for The Drying, Degumming and Curing of Electronic Components in a Vacuum or Atmosphere Environment
  • Hpf190-03n Vacuum Oven, Mainly Used for The Drying, Degumming and Curing of Electronic Components in a Vacuum or Atmosphere Environment
  • Hpf190-03n Vacuum Oven, Mainly Used for The Drying, Degumming and Curing of Electronic Components in a Vacuum or Atmosphere Environment
  • Hpf190-03n Vacuum Oven, Mainly Used for The Drying, Degumming and Curing of Electronic Components in a Vacuum or Atmosphere Environment
  • Hpf190-03n Vacuum Oven, Mainly Used for The Drying, Degumming and Curing of Electronic Components in a Vacuum or Atmosphere Environment
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Basic Info.

Model NO.
HPF190-03N
Range of Applications
Industrial
Type
Electric Holding Furnace
Usage
Drying
Fuel
Electric
Working Temperature
Rt~200ºC
Maximum Temperature
250ºC
Transport Package
Wooden Packaging
Specification
755*1680*950mm(W*H*D)
Trademark
Chitherm
Origin
China
HS Code
8514101000
Production Capacity
50 Sets/Year

Product Description

 
1. Equipment Name and Model:
HPF190-03N Vacuum Oven

2. Application Fields:
It is mainly used for the drying, degumming and curing of electronic components in a vacuum or atmosphere environment.


3. Technical Indicators and Basic Configuration
3.1 Working Temperature: RT~200ºC;
3.2 Maximum Temperature: 250ºC;
3.3 Furnace Chamber Material: SUS304 Stainless Steel;
3.4 Insulation Material: Ceramic Fiber;
3.5 Furnace Chamber Size: 500mm×700mm×550mm (W*H*D);
3.6 Temperature Uniformity: The surface of the heating plate is better than ±5ºC (test at a constant temperature of 200ºC);
3.7 Heating Element: Aluminum Heating Plate;
3.8 Number of Heating Plates: 4 pieces;
3.9 Maximum Heating Power: 4×1.5kW;
3.10 Heating Rate: ≤5ºC/min;
3.11 Temperature Control Element: Platinum Resistance;
3.12 Number of Temperature Control Points: 4 points;
3.13 Temperature Control Mode: Zero-Crossing of Cycle;
3.14 Total Control Mode: Centralized Control by Touch Screen + PLC;
3.15 Temperature Control Accuracy: ±1ºC;
3.16 Ultimate Vacuum Degree: ≤50Pa;
3.17 Vacuum Pumping Time: ≤30min (from atmospheric pressure to 0.1mbar);
3.18 Furnace Chamber Pressure Resistance: 0.1~1mbar (can be used in vacuum or normal pressure state);
3.19 Vacuum Alarm: When the vacuum degree fails to reach the set value within the given time, an alarm signal will be given, and at the same time, the vacuum pump will be turned off to prevent the vacuum pump from running under high load for a long time and extend its service life;
3.20 Alarm Protection: It has audible and visual alarm protection functions such as over-temperature, motor overload, and under-phase and reverse-phase;
3.21 Equipment Noise: ≤63dB;
3.22 Equipment Appearance: High-temperature spray painting, light gray;
3.23 Reference Dimensions of the External Shape: 755mm×1680mm×950mm (W*H*D).

4. Overall Technical Description
The whole oven is mainly divided into three major parts, namely the furnace body structure, the vacuum system, and the control system.

                                 Hpf190-03n Vacuum Oven, Mainly Used for The Drying, Degumming and Curing of Electronic Components in a Vacuum or Atmosphere Environment                           
4.1 Furnace Body Design
The furnace chamber is processed and made of SUS304 plates; it is provided with an air inlet, an air outlet and a vacuum detection port; 4 heating plates divide the heating cavity into 3 small cavities, and the height of each cavity is 150mm; the products are directly or indirectly placed on the heating plates through trays. By leading the terminals of the heating plates out of the furnace chamber and using a special vacuum sealing method, high sealing performance is achieved; the sealing plate of the furnace door is customized with high-temperature and high-pressure resistant glass, and it plays a sealing role for the furnace chamber by extruding with the sealing strip at the end face of the furnace chamber.
4.2 Vacuum System Design
Reserve vacuum interfaces and relevant vacuum valves.
4.3 Air Inlet Design
The equipment is equipped with a nitrogen inlet interface. The on-off of the air inlet is controlled by a vacuum valve, and the size of the air inlet flow is controlled by a glass rotor flowmeter with a measuring range of 10~100L/min.
4.4 Control System Design
Adopt a centralized control mode with a touch screen that has a user-friendly human-machine interface.
4.4.1 Temperature Measurement and Control: The temperature is measured by a platinum resistance, and the temperature value is sent to the temperature control module by an imported temperature module for analysis and control.
4.4.2 Centralized Control: Centralized control by the touch screen, and relevant data such as temperature and alarm indication are displayed on the touch screen for convenient observation and operation.
4.4.3 Alarm System: When the temperature exceeds the set value, the over-temperature alarm system will immediately send out audible and visual alarm signals and cut off the heating at the same time, and the buzzer will emit a continuous alarm sound.


5. Equipment Handover List
Delivery Schedule
Name Main Content Quantity  
Basic Composition Main Kiln Furnace Unit   1 set
Inspection Certificate of Conformity Certificates of Conformity for Each Main Outsourced Component 1 set
Technical Documents Instruction Manual, Random Technical Documents of Each Main Outsourced Component, etc. 1 set
Key Components Heating Plate   4 pieces
Touch Screen   1 set
Resistance Vacuum Gauge   1 set
Resistance Gauge   1 piece
Spare Parts Solid State Relay   1 piece

Hpf190-03n Vacuum Oven, Mainly Used for The Drying, Degumming and Curing of Electronic Components in a Vacuum or Atmosphere EnvironmentHpf190-03n Vacuum Oven, Mainly Used for The Drying, Degumming and Curing of Electronic Components in a Vacuum or Atmosphere EnvironmentHpf190-03n Vacuum Oven, Mainly Used for The Drying, Degumming and Curing of Electronic Components in a Vacuum or Atmosphere Environment
 

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