for Drying, Curing, or Degreasing of Semiconductors, Electronic Components, or Materials

Product Details
Customization: Available
Certification: ISO
Place Style: Vertical
Gold Member Since 2024

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  • for Drying, Curing, or Degreasing of Semiconductors, Electronic Components, or Materials
  • for Drying, Curing, or Degreasing of Semiconductors, Electronic Components, or Materials
  • for Drying, Curing, or Degreasing of Semiconductors, Electronic Components, or Materials
  • for Drying, Curing, or Degreasing of Semiconductors, Electronic Components, or Materials
  • for Drying, Curing, or Degreasing of Semiconductors, Electronic Components, or Materials
  • for Drying, Curing, or Degreasing of Semiconductors, Electronic Components, or Materials
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Basic Info.

Model NO.
HRF180-05
Range of Applications
Industrial
Type
Electric Holding Furnace
Usage
Drying
Fuel
Electric
Atmosphere
Air
Effective Chamber Dimensions
600*500*600mm(W*D*H)
Transport Package
Wooden Packaging
Specification
1110*1050*1820mm(W*H*D)
Trademark
Chitherm
Origin
China
HS Code
8514101000
Production Capacity
50 Sets/Year

Product Description

1. Overview
The HRF180-05 Rapid Annealing Furnace is primarily designed for processes such as drying, curing, or degreasing of semiconductors, electronic components, or materials. The equipment features a specially designed cage-type heating element, a centrifugal fan for air circulation, a double-layer stainless steel structure, full fiber insulation, and an imported single-loop intelligent temperature controller.

2. Performance Parameters
Model: HRF180-05
Operating Temperature Range: RT~400ºC
Maximum Temperature: 450ºC
Effective Chamber Size: 600×500×600 (W×D×H) mm
Hot Air Circulation System: Specially designed stainless steel high-pressure multi-wing fan, centrifugal air delivery, horizontal air flow
No-load Heating Rate: ≤5ºC/min
Exhaust Vent: 1
Door Opening Style: Left-opening
Heating Element: Specially designed cage-type heater
Thermocouple Type: K-type
Control Stability: ±1ºC
Temperature Control Points: Single point, controlled by a Japanese Shimaden intelligent programmable temperature controller with PID auto-tuning function, 4×10 segment curves
Temperature Uniformity: Better than ±5ºC
Loading Device: 3 stainless steel trays
Alarm and Protection: Over-temperature, thermocouple breakage, and other audible and visual alarms; interlock between heating and fan; independent temperature-sensing over-temperature protection for the heating chamber; motor phase loss protection; over-current protection; dual-color alarm indicator
Ambient Temperature: 0ºC~40ºC
Ambient Humidity: 0~50%RH
Surface Temperature Rise: ≤35ºC
Maximum Heating Power: 12kW
Power Supply: Three-phase, 380VAC, 50Hz
Overall Dimensions: 1110mm×995mm×1818mm (W×D×H)
 for Drying, Curing, or Degreasing of Semiconductors, Electronic Components, or Materials
for Drying, Curing, or Degreasing of Semiconductors, Electronic Components, or Materials
for Drying, Curing, or Degreasing of Semiconductors, Electronic Components, or Materials



 
3. Delivery List
  Item Note Qty.
Basic Components Furnace   1 unit
inspection certificate Certificate of major outsourced components 1 SET
Technical Documents Instructions, technical documents of the major outsourced parts, etc 1 SET
Key Components Heating Element   1 SET
Temperature Controller   1 SET
Circulation Fan   1 SET
Spare Parts SSR   1 pcs
Heating wire   1 PC
 
4. Normal Operating Conditions
1.Environmental Conditions: Temperature 0 to 40°C, humidity ≤80% RH, no corrosive gases, no strong air disturbance;
2. Ventilation System: Non-contact connection to the user's extraction system, with an extraction capacity greater than 5 m³/h;
3. Floor Requirements: Level, no significant vibration, load-bearing capacity >200 Kg/m²;
4. Power Requirements: Capacity greater than 16 kVA, 3-phase 5-wire, voltage 220/380V, frequency 50Hz. Live wires: Yellow, Green, Red; Neutral wire: Blue; Earth wire: Green/Yellow;
5. Installation Site: 2000mm × 1800mm × 3000mm (W × D × H), installation area should be greater than 4m².


for Drying, Curing, or Degreasing of Semiconductors, Electronic Components, or Materials
 

 

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